• DocumentCode
    1855555
  • Title

    CFD analysis of the thermal interruption process of gases with low environmental impact in high voltage circuit breakers

  • Author

    Ye, X. ; Dhotre, M.T. ; Mantilla, J.D. ; Kotilainen, S.

  • Author_Institution
    ABB Switzerland Ltd., Baden, Switzerland
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    375
  • Lastpage
    378
  • Abstract
    Gases and gas mixtures with lower environmental impact are being investigated as possible alternatives to SF6 as the switching medium in high voltage circuit breakers. One of the most important aspects of the investigation is the thermal interruption characteristic which depends on flow acceleration, and efficient cooling of the arc around current zero. In the present work, the influence of the gas properties on the thermal interruption capability is investigated using Computational Fluid Dynamics (CFD). A gas mixture of fluroketones with CO2 as background gas is considered. The underlying thermal interruptions behavior of this gas mixture is compared with that of SF6. The individual influence of the axial flow parameters namely pressure, velocity, Mach number and density on thermal interruption is studied. A thermal interruption proxy parameter is derived by combining the axial flow variables, which can better characterize the thermal interruption. The differences between the different gases using this proxy are presented. The design parameters influencing the pressure build-up and thermal interruption behavior are investigated and discussed.
  • Keywords
    Mach number; SF6 insulation; circuit breakers; computational fluid dynamics; gas mixtures; gases; CFD analysis; Mach number; SF6; computational fluid dynamics; flow acceleration; fluroketones gas mixture; gas mixtures; gases; high voltage circuit breakers; thermal interruption characteristic; thermal interruption process; thermal interruption proxy parameter; Gases; CFD; Fluoroketones; flow; high voltage circuit breaker; thermal interruption;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223581
  • Filename
    7223581