Title :
Microstructural investigation of new thick-film paste flux for contacting silicon solar cells
Author :
Li, Zhigang Rick ; Mikeska, Kurt R. ; VerNooy, Paul D. ; Liang, Liang
Author_Institution :
Central R&D, Exp. Station, DuPont Co., Wilmington, DE, USA
Abstract :
This paper discusses a microstructural investigation of p-type crystalline silicon (c-Si) solar cells printed with a newly developed screen-printable paste flux additive, which demonstrates better cell performance compared to current industry-standard commercial pastes. Advanced electron microscopy techniques were used to study in detail the microstructure of the front-side (FS) Ag contact interface region of c-Si cells printed with either the paste containing the new flux additive or a commercial paste. Our results reveal that solar cells fabricated with the new flux additive paste had more uniform and longer regions of ultra-thin interfacial glass at the FS Ag-silicon interface, which results in improved series resistance and reduced emitter/junction damage. The current conduction mechanism of FS contact of c-Si solar cells made with this new paste is described.
Keywords :
electron microscopy; silicon; solar cells; thick films; FS; Si; current conduction mechanism; current industry-standard commercial pastes; electron microscopy technigues; emitter-junction damage reduction; front-side contact interface region; improved series resistance; microstructural investigation; p-type crystalline solar cells; screen-printable paste flux additive; thick-film paste flux; ultra-thin interfacial glass; Glass; Microstructure; Photovoltaic cells; Resistance; Scanning electron microscopy; Silicon; Tunneling;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4244-9966-3
DOI :
10.1109/PVSC.2011.6185944