• DocumentCode
    1856281
  • Title

    Dielectric response and thermal conductivity of nanostructured microcomposites: High Density Polyethylene filled with a mixture of ZnO and HCl doped polyaniline

  • Author

    Vanga-Bouanga, C. ; Frechette, M.F. ; David, E.

  • Author_Institution
    Inst. de Rech. d´Hydro-Quebec, QC, Canada
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    496
  • Lastpage
    500
  • Abstract
    In this study, polyaniline (PAni), was used to surround Zinc Oxide (ZnO) nanoparticles to be dispersed in a High Density Polyethylene (HDPE) matrix. The dielectric properties of the composite samples were characterized using dielectric spectroscopy in a wide range of frequencies (10-2 Hz - 1 MHz) at room temperature. Interesting results were found especially for the sample containing 10 wt% of ZnO/PAni. The presence of PAni in the composite systems contributes to an increase in conductivity of two orders of magnitude. An interfacial relaxation peak was observed for all composite films and was found to shift toward higher frequency when the amount of PAni surrounding the ZnO particle increased. The thermal conductivity of HDPE-ZnO/PAni-10 10 wt% was also greatly improved, i.e. by about 35% in comparison with that of the pure matrix.
  • Keywords
    II-VI semiconductors; conducting polymers; dielectric relaxation; dielectric thin films; filled polymers; hydrogen compounds; nanocomposites; nanoparticles; permittivity; thermal conductivity; wide band gap semiconductors; zinc compounds; HCl doped polyaniline; ZnO; composite films; dielectric properties; dielectric spectroscopy; frequency 0.01 Hz to 1 MHz; high density polyethylene; interfacial relaxation; nanostructured microcomposites; temperature 293 K to 298 K; thermal conductivity; zinc oxide nanoparticles; Dielectrics; Furnaces; Heating; II-VI semiconductor materials; Nitrogen; Polymers; Zinc oxide; conductivity; dielectric properties; high density polyethylene; polyaniline; thermal properties; zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223613
  • Filename
    7223613