A 3D glass microprobe array with embedded silicon for alignment and electrical connection

This study presents a simple process to assemble the 3D glass microprobe array. Glass microprobe with embedded silicon (ES) was fabricated by glass reflow process. In the 1^st assembly, the chips with 2D glass microprobe array were bonded by parylene-C to form the 3D the microprobe array. In the 2^nd assembly, the 3D probe array was then mounted on the silicon carrier. The ES is employed for alignment during the assembly, and also acts as the electrical routing for signal recording. In application, the impedance of this glass microprobe was measured. The impedance at 1 kHz was 1.1 MOmega. Action potential from crayfish nerve cord was also successfully recorded.