Title :
Direct pick, break, and placement of nanostructures and their integration with MEMS
Author :
Sosnowchik, Brian D. ; Chang, Jiyoung ; Lin, Liwei
Author_Institution :
Dept. of Mech. Eng., Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
A direct, simple, and versatile assembly method for the manipulation of one-dimensional nanostructures and their integration with MEMS has been demonstrated. Using common MEMS equipment - an optical microscope and an unbiased tungsten probe - the facile process has been employed to accurately manipulate titanium dioxide nanoswords and zinc oxide nanowires under a room-temperature, dry environment. The surface morphology of the nanostructures, probe tips, and adhesion forces were characterized. Using this process, a nanosword was integrated with a MEMS device to characterize its sensitivity to ultraviolet light. As such, the technique could enable the rapid assembly of individual nanostructures with CMOS-compatible devices.
Keywords :
II-VI semiconductors; adhesion; micromechanical devices; nanowires; optical microscopy; semiconductor quantum wires; surface morphology; titanium compounds; zinc compounds; CMOS-compatible devices; MEMS; TiO2; ZnO; adhesion forces; dry environment; one dimensional nanostructures; optical microscope; surface morphology; temperature 293 K to 298 K; titanium dioxide nanoswords; ultraviolet light; unbiased tungsten probe; versatile assembly method; zinc oxide nanowires; Assembly; Micromechanical devices; Nanostructures; Nanowires; Optical microscopy; Optical sensors; Probes; Titanium; Tungsten; Zinc oxide; Nanostructure Integration Pick and Place; Nanostructure Manipulation; TiO2 Nanoswords; ZnO Nanowires;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285606