Title :
Maxima-SPRT methodology for health monitoring of contact resistance in IC sockets
Author :
Lopez, Leoncio D. ; Pecht, Michael G.
Author_Institution :
RAS Comput. Anal. Lab., Sun Microsyst., Inc, San Diego, CA
Abstract :
The evaluation of integrated circuit sockets for quality, reliability, and/or prognostic applications is performed with accelerated tests and stress conditions that are defined by industry standards. These methods typically use threshold values to detect degradation and failures of the electrical interconnect. However, this approach does not consider the physics of failure of the component under test and is not sensitive enough to detect small changes in behavior. This paper presents a physics of failure based methodology that, combined with a sequential probability ratio test, overcomes the issues of the traditional approach. This new approach, called Maxima-SPRT, enables early detection of degradation and provides the information needed for the successful implementation of prognostic tools. The method is validated using an elastomer socket, a daisy chain package, and a test board assembly.
Keywords :
condition monitoring; contact resistance; elastomers; electric connectors; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; accelerated tests; contact resistance; daisy chain package; elastomer socket; electrical interconnects; failure; health monitoring; integrated circuit sockets; maxima-SPRT methodology; prognostic applications; reliability; sequential probability ratio test; test board assembly; Application specific integrated circuits; Circuit testing; Condition monitoring; Contact resistance; Degradation; Integrated circuit reliability; Life estimation; Performance evaluation; Physics; Sockets; Accelerated test; contact resistance; elastomer socket; health monitoring; physics of failure;
Conference_Titel :
Prognostics and Health Management, 2008. PHM 2008. International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-1935-7
Electronic_ISBN :
978-1-4244-1936-4
DOI :
10.1109/PHM.2008.4711465