• DocumentCode
    1856630
  • Title

    CuInS2 thin film with flat surface by crystalization of Cu-In-S precursor

  • Author

    Minemoto, T. ; Kondo, T. ; Oda, Y. ; Takakura, H.

  • Author_Institution
    Coll. of Sci. & Eng., Ritsumeikan Univ., Kusatsu, Japan
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    CuInS2 (CIS) films used in the absorber layer of solar cells are often prepared by the sulfurization of Cu-In metallic precursors. The CIS films usually show large surface roughness, which would decrease the open-circuit voltage of the solar cell because of a large np junction area and insufficient surface coverage of buffer layers. In this study, Cu-In-S precursors were deposited at the low temperature of 50°C and the films were subsequently annealed to promote crystal growth at the high temperature of 500~600°C with sulfur supply. The annealed films successfully showed flat surface morphology and large crystal grain size of around 1 μm which was comparable to that of the CIS films prepared by the sulfurization of Cu-In metallic precursors. The root-mean-square roughness of 60 nm was smaller compared to that of the CIS films fabricated by the sulfurization of the Cu-In metallic precursors of 210 nm and comparable to that of Cu(In, Ga)Se2 films used in high efficiency solar cells.
  • Keywords
    crystal growth; crystallisation; semiconductor growth; semiconductor thin films; solar cells; ternary semiconductors; thin film devices; CIS films; CuInS2; crystal grain; crystal growth; flat surface; metallic precursor crystallization; root-mean-square roughness; size 60 nm; solar cell absorbers; solar cell open-circuit voltage; sulfur supply; temperature 50 degC; temperature 500 degC to 600 degC; thin film; Annealing; Films; Photovoltaic cells; Rough surfaces; Surface morphology; Surface roughness; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6185980
  • Filename
    6185980