DocumentCode :
1856810
Title :
Heat transfer in high-power LED with thermally conductive particle-filled epoxy composite as thermal interface material for system-level analysis
Author :
Anithambigai, P. ; Shanmugan, S. ; Mutharasu, D. ; Ibrahim, Khalil
Author_Institution :
Sch. of Phys., Univ. Sains Malaysia (USM), Minden, Malaysia
fYear :
2013
fDate :
26-28 Aug. 2013
Firstpage :
339
Lastpage :
344
Abstract :
This paper elucidates the thermal behaviour of an LED employing different particles filled epoxy as thermal interface material (TIM) for enhanced heat dissipation. Highly thermal conductive metal filler of aluminium (Al) and ceramic fillers of aluminium nitride (AlN) and aluminium oxide (Al2O3) were incorporated in bisphenol A diglycidylether (DGEBA) epoxy resin to identify the effect of the filler materials as TIM on the thermal performance of high power LEDs. From the thermal transient analysis of a 3W warm white LED, it was observed that the Al filled composite exhibits the lowest junction temperature of 38.3 °C compared to the other two fillers. The total thermal resistance of the package with AlN filled composite and Al2O3 filled composite were 13.77 and 15.50K/W respectively. This paper too suggests that the total thermal resistance of the LED package increases when the particle size of the fillers decrease.
Keywords :
III-V semiconductors; alumina; ceramics; cooling; light emitting diodes; resins; thermal resistance; transient analysis; wide band gap semiconductors; Al; Al2O3; AlN; DGEBA epoxy resin; LED package; TIM; bisphenol A diglycidylether; ceramic fillers; enhanced heat dissipation; heat transfer; high-power LED; power 3 W; system-level analysis; temperature 38.3 degC; thermal behaviour; thermal interface material; thermal resistance; thermal transient analysis; thermally conductive particle-filled epoxy composite; warm white LED; Aluminum oxide; III-V semiconductor materials; Junctions; Light emitting diodes; Plastics; Thermal conductivity; Thermal resistance; epoxy resin; fillers; junction temperature; particle size; thermal interface material; thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ASQED), 2013 5th Asia Symposium on
Conference_Location :
Penang
Print_ISBN :
978-1-4799-1312-1
Type :
conf
DOI :
10.1109/ASQED.2013.6643610
Filename :
6643610
Link To Document :
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