• DocumentCode
    1857080
  • Title

    Using plastic-encapsulated microcircuits in high reliability applications

  • Author

    Condra, L.W. ; Kromholtz, G.A. ; Pecht, M.G. ; Hakim, E.B.

  • Author_Institution
    ELDEC Corp., Lynnwood, WA, USA
  • fYear
    1994
  • fDate
    24-27Jan 1994
  • Firstpage
    481
  • Lastpage
    493
  • Abstract
    This paper describes technical and management aspects of using plastic-encapsulated microcircuits (PEM´s) in applications in which military, hermetic microcircuits have traditionally been required. In order to implement the use of PEM´s in such applications, it is necessary to re-evaluate the entire system of qualifying, procuring, using, and ensuring reliability of parts, and of the products in which they are used. Technically, the disciplines of reliability, accelerated testing, design of experiments, and physics of failure must be used as a comprehensive set of tools to implement and manage the use of PEM´s. Finally, an effective and efficient system for collecting and analyzing data must be set up to provide information for rational decision-making
  • Keywords
    circuit reliability; encapsulation; integrated circuits; military equipment; accelerated testing; high reliability applications; military hermetic microcircuits; plastic-encapsulated microcircuits; Aerospace industry; Control systems; Costs; Failure analysis; Life estimation; Materials reliability; Materials testing; Physics; Quality management; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1994. Proceedings., Annual
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    0-7803-1786-6
  • Type

    conf

  • DOI
    10.1109/RAMS.1994.291155
  • Filename
    291155