DocumentCode
1857080
Title
Using plastic-encapsulated microcircuits in high reliability applications
Author
Condra, L.W. ; Kromholtz, G.A. ; Pecht, M.G. ; Hakim, E.B.
Author_Institution
ELDEC Corp., Lynnwood, WA, USA
fYear
1994
fDate
24-27Jan 1994
Firstpage
481
Lastpage
493
Abstract
This paper describes technical and management aspects of using plastic-encapsulated microcircuits (PEM´s) in applications in which military, hermetic microcircuits have traditionally been required. In order to implement the use of PEM´s in such applications, it is necessary to re-evaluate the entire system of qualifying, procuring, using, and ensuring reliability of parts, and of the products in which they are used. Technically, the disciplines of reliability, accelerated testing, design of experiments, and physics of failure must be used as a comprehensive set of tools to implement and manage the use of PEM´s. Finally, an effective and efficient system for collecting and analyzing data must be set up to provide information for rational decision-making
Keywords
circuit reliability; encapsulation; integrated circuits; military equipment; accelerated testing; high reliability applications; military hermetic microcircuits; plastic-encapsulated microcircuits; Aerospace industry; Control systems; Costs; Failure analysis; Life estimation; Materials reliability; Materials testing; Physics; Quality management; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 1994. Proceedings., Annual
Conference_Location
Anaheim, CA
Print_ISBN
0-7803-1786-6
Type
conf
DOI
10.1109/RAMS.1994.291155
Filename
291155
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