Title :
Using plastic-encapsulated microcircuits in high reliability applications
Author :
Condra, L.W. ; Kromholtz, G.A. ; Pecht, M.G. ; Hakim, E.B.
Author_Institution :
ELDEC Corp., Lynnwood, WA, USA
Abstract :
This paper describes technical and management aspects of using plastic-encapsulated microcircuits (PEM´s) in applications in which military, hermetic microcircuits have traditionally been required. In order to implement the use of PEM´s in such applications, it is necessary to re-evaluate the entire system of qualifying, procuring, using, and ensuring reliability of parts, and of the products in which they are used. Technically, the disciplines of reliability, accelerated testing, design of experiments, and physics of failure must be used as a comprehensive set of tools to implement and manage the use of PEM´s. Finally, an effective and efficient system for collecting and analyzing data must be set up to provide information for rational decision-making
Keywords :
circuit reliability; encapsulation; integrated circuits; military equipment; accelerated testing; high reliability applications; military hermetic microcircuits; plastic-encapsulated microcircuits; Aerospace industry; Control systems; Costs; Failure analysis; Life estimation; Materials reliability; Materials testing; Physics; Quality management; Stress;
Conference_Titel :
Reliability and Maintainability Symposium, 1994. Proceedings., Annual
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-1786-6
DOI :
10.1109/RAMS.1994.291155