• DocumentCode
    1857096
  • Title

    An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors

  • Author

    Tien, Kevin ; Sturcken, Noah ; Naigang Wang ; Jae-woong Nah ; Bing Dang ; O´Sullivan, Eugene ; Andry, Paul ; Petracca, Michele ; Carloni, Luca P. ; Gallagher, William ; Shepard, Kenneth

  • Author_Institution
    Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
  • fYear
    2015
  • fDate
    16-18 June 2015
  • Abstract
    This paper presents a three-dimensional (3D) fully integrated high-speed multiphase voltage regulator. A complete switched-inductor regulator is integrated with a four-plane NoC in a two-high chip stack combining integrated magnetics, through-silicon vias (TSVs), and 45-nm SOI CMOS devices. Quasi-V2 hysteretic control is implemented over eight injection-locked fixed-frequency phases to achieve fast response, steady-state regulation, and fixed switching frequency. Peak efficiency of 82% for conversion from 1.66 V to 0.83 V is observed at a 150 MHz per-phase switching frequency. This is the first demonstration of high-speed voltage regulation using on-chip magnetic-core inductors in a 3D stack and achieves sub-μs dynamic supply voltage scaling for high-density embedded processing applications.
  • Keywords
    CMOS integrated circuits; inductors; network-on-chip; silicon-on-insulator; three-dimensional integrated circuits; voltage regulators; 3D fully integrated high-speed multiphase voltage regulator; SOI CMOS devices; TSV; dynamic supply voltage scaling; efficiency 82 percent; four-plane NoC; frequency 150 MHz; high-density embedded processing applications; high-speed voltage regulation; injection-locked fixed-frequency phases; integrated magnetics; on-chip magnetic-core inductors; quasi-V2 hysteretic control; size 45 nm; switched-inductor regulator; three-dimensional fully integrated high-speed multiphase voltage regulator; through-silicon vias; two-high chip stack; voltage 1.66 V to 0.83 V; Inductors; Magnetic domains; Magnetic hysteresis; Regulators; Three-dimensional displays; Through-silicon vias; Voltage control; 3D integration; DVFS; TSVs; buck converter; integrated magnetics; nonlinear control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI Technology), 2015 Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2015.7223648
  • Filename
    7223648