DocumentCode
1857717
Title
Atomic metal contacts on the semiconductor by CVD
Author
Lung, Chien-Hwa ; Lin, Ching-Fuh ; Chang, Che-Chen
Author_Institution
Nat. Taiwan Univ., Taipei, Taiwan
fYear
2005
fDate
11-15 July 2005
Firstpage
315
Abstract
The continuing advances in miniaturization of semiconductor devices have seriously challenged the contact technology. This work explored the chemical reaction involved in the bottom-up formation of metal contacts using a linear atomic metal string complex for CVD. The adsorption and surface reaction of the complex on GaN were characterized using x-ray photoelectron spectroscopy and secondary ion mass spectrometry. The complex may anchor on the substrate surface with the metal string inclined to the surface. A change in bonding configuration of the chromium metal-string complex took place upon increasing complex dose to the substrate.
Keywords
III-V semiconductors; X-ray photoelectron spectra; adsorption; bonds (chemical); chemical vapour deposition; gallium compounds; nanocontacts; organometallic compounds; secondary ion mass spectra; surface chemistry; CVD; GaN; X-ray photoelectron spectroscopy; adsorption; atomic metal contact; atomic metal string complex; bonding; chemical reaction; chromium metal-string complex; secondary ion mass spectrometry; semiconductor devices; surface reaction; Atomic layer deposition; Atomic measurements; Bonding; Chemical compounds; Chemical technology; Chemical vapor deposition; Chemistry; Semiconductor films; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2005. 5th IEEE Conference on
Print_ISBN
0-7803-9199-3
Type
conf
DOI
10.1109/NANO.2005.1500759
Filename
1500759
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