DocumentCode
1857737
Title
Low Cost, Biocompatible Elastic and Conformable Electronic Technologies using Mid in Stretchable Polymer
Author
Axisa, F. ; Brosteaux, D. ; De Leersnyder, E. ; Bossuyt, F. ; Gonzalez, M. ; De Smet, N. ; Schacht, E. ; Rymarczyk-Machal, M. ; Vanfleteren, J.
Author_Institution
IMEC/TFCG Microsyst., Ghent
fYear
2007
fDate
22-26 Aug. 2007
Firstpage
6592
Lastpage
6595
Abstract
For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the results of an MID (Molded Interconnect Device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped metallic wires and embedded by molding in a stretchable substrate polymer. Several technologies have been developed to this purpose, which combine low cost and good reliability under mechanical strain. In this way reliable stretchability of the circuits above 100 % has been demonstrated. Enhanced reliability has been reached using an additional conductive polymer layer.
Keywords
biomedical electronics; biomedical materials; conducting polymers; integrated circuit interconnections; moulding; printed circuit manufacture; surface mount technology; MID; biocompatible conformable electronic technology; biocompatible elastic electronic technology; conductive polymer layer; functional stretchable electronic circuits; implanted electronic circuits; meander shaped metallic wires; molded interconnect device technology; smart clothes; stretchable polymer; stretchable substrate polymer; Biological materials; Biomedical materials; Capacitive sensors; Conducting materials; Costs; Electronic circuits; Integrated circuit interconnections; Polymers; Shape; Substrates; Coated Materials, Biocompatible; Copper; Elasticity; Electronics; Finite Element Analysis; Gold; Hydrophobic and Hydrophilic Interactions; Nickel; Prostheses and Implants; Silicone Elastomers; Stress, Mechanical; Telemetry; Textiles; Vinyl Compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location
Lyon
ISSN
1557-170X
Print_ISBN
978-1-4244-0787-3
Type
conf
DOI
10.1109/IEMBS.2007.4353870
Filename
4353870
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