• DocumentCode
    1857737
  • Title

    Low Cost, Biocompatible Elastic and Conformable Electronic Technologies using Mid in Stretchable Polymer

  • Author

    Axisa, F. ; Brosteaux, D. ; De Leersnyder, E. ; Bossuyt, F. ; Gonzalez, M. ; De Smet, N. ; Schacht, E. ; Rymarczyk-Machal, M. ; Vanfleteren, J.

  • Author_Institution
    IMEC/TFCG Microsyst., Ghent
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    6592
  • Lastpage
    6595
  • Abstract
    For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the results of an MID (Molded Interconnect Device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped metallic wires and embedded by molding in a stretchable substrate polymer. Several technologies have been developed to this purpose, which combine low cost and good reliability under mechanical strain. In this way reliable stretchability of the circuits above 100 % has been demonstrated. Enhanced reliability has been reached using an additional conductive polymer layer.
  • Keywords
    biomedical electronics; biomedical materials; conducting polymers; integrated circuit interconnections; moulding; printed circuit manufacture; surface mount technology; MID; biocompatible conformable electronic technology; biocompatible elastic electronic technology; conductive polymer layer; functional stretchable electronic circuits; implanted electronic circuits; meander shaped metallic wires; molded interconnect device technology; smart clothes; stretchable polymer; stretchable substrate polymer; Biological materials; Biomedical materials; Capacitive sensors; Conducting materials; Costs; Electronic circuits; Integrated circuit interconnections; Polymers; Shape; Substrates; Coated Materials, Biocompatible; Copper; Elasticity; Electronics; Finite Element Analysis; Gold; Hydrophobic and Hydrophilic Interactions; Nickel; Prostheses and Implants; Silicone Elastomers; Stress, Mechanical; Telemetry; Textiles; Vinyl Compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353870
  • Filename
    4353870