• DocumentCode
    1857878
  • Title

    Development of a shock acceleration microswitch with enhanced-contact and low off-axis sensitivity

  • Author

    Yang, Z.Q. ; Ding, G.F. ; Cai, H.G. ; Wang, H. ; Chen, W.Q. ; Zhao, X.L.

  • Author_Institution
    Res. Inst. of Micro/Nano Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1940
  • Lastpage
    1943
  • Abstract
    In the present work, microswitches with different shapes have been fabricated by low-cost and convenient multi-layer electroplating in order to develop a shock acceleration microswitch with enhanced-contact and low off-axis sensitivity. Modal analysis based on FEM shows that the three kinds of new designed microswitches have lower off-axis sensitivity than our previous device, i.e., type I. The packaged microswitches were tested by the drop hammer system. The generated half-sine-like shocking acceleration with amplitude of 80 g, lager than the threshold, was applied to the microswitches. The test contact time of the microswitch IV is about 55 mus, whose contact effect is much better than conventional. A shock acceleration microswitch IV with a movable contact point utilizes the double spring-mass system to realize an enhanced-contact effect and is considered as a better selection for long duration contact and relatively low off-axis sensitivity.
  • Keywords
    electroplating; finite element analysis; microfabrication; microswitches; modal analysis; FEM; double spring-mass system; drop hammer system; enhanced-contact sensitivity; half-sine-like shocking acceleration; low off-axis sensitivity; microswitch IV; modal analysis; movable contact point; multilayer electroplating; shock acceleration microswitch; Acceleration; Contacts; Electric shock; Electrodes; Micromachining; Microswitches; Nickel; Shape; Switches; System testing; Acceleration microswitch; MEMS; enhanced-contact;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285669
  • Filename
    5285669