• DocumentCode
    1857923
  • Title

    A novel differential capacitive-sensing dual-axis accelerometer design using pendulum-proofmass, gimbal-springs, and harm vertical-combs

  • Author

    Chan, Chun-Kai ; Hsu, Chia-Pao ; Wu, Mingching ; Hocheng, Hong ; Chen, Rongshun ; Fang, Weileun

  • Author_Institution
    Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1944
  • Lastpage
    1947
  • Abstract
    This study presents a novel dual-axis capacitive-type accelerometer design consists of a pendulum-proofmass (bulk Si), a gimbal-spring (poly-Si film), and vertical-combs sensing electrodes. This design has three merits, (1) pendulum-proofmass to produce torque by in-plane acceleration (offset-axis inertial force), (2) gimbal-springs enable the detection of dual-axis accelerations, and (3) high-aspect-ratio-micromachined (HARM) vertical-combs as the differential sensing electrodes to detect angular motion. In short, applying the HARM vertical-combs for differential capacitive sensing to detect the offset-axis inertial force is firstly implemented in this work. Measurement results show that sensitivities (non-linearity) of etch direction are 2.44 mV/G (0.04%) of X-axis, and 51.99 mV/G (0.11%) of Y-axis (measurement range: 0.05 G~2G). The resolution is 50 mG for both axes. The cross-axis errors range from 0.005% to 11%.
  • Keywords
    accelerometers; capacitive sensors; pendulums; silicon; angular motion detection; bulk Si; differential capacitive-sensing dual-axis accelerometer design; gimbal-springs; high-aspect-ratio-micromachined vertical-combs; in-plane acceleration; offset-axis inertial force detection; pendulum-proofmass; poly-Si film; vertical-combs sensing electrodes; Acceleration; Accelerometers; Actuators; Electrodes; Etching; Fabrication; Micromachining; Mirrors; Motion detection; Semiconductor films; Accelerometer; Capacitive; Gimbal-spring; HARM; Pendulum-proofmass;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285670
  • Filename
    5285670