DocumentCode
1857953
Title
Silicon wafer-area network: intelligent communications fabric for parallel computing
Author
Petrova, I.V. ; Uppuluri, M.T. ; Tewksbury, S.K. ; Hornak, Lawrence A.
Author_Institution
Dept. of Electr. & Comput. Eng., West Virginia Univ., Morgantown, WV, USA
fYear
1994
fDate
19-21 Jan 1994
Firstpage
362
Lastpage
373
Abstract
The SWAN (silicon wafer-area network) project described explores the application of the high speed and high density of interconnections in WSI and MCM technologies to new communications schemes for general purpose, parallel arrays of computing nodes. The SWAN architecture seeks to provide on-demand, point-to-point communications through dynamically allocated routes for fine-grained communications
Keywords
VLSI; multichip modules; multiprocessor interconnection networks; parallel architectures; MCM technologies; SWAN architecture; WSI; dynamically allocated routes; fine-grained communications; interconnections; parallel arrays; point-to-point communications; silicon wafer-area network; Computer architecture; Computer networks; Concurrent computing; Fabrics; Intelligent networks; Microelectronics; Parallel processing; Routing; Silicon; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-1850-1
Type
conf
DOI
10.1109/ICWSI.1994.291237
Filename
291237
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