FIB and E-beam cross-linked poly(N-isopropylacrylamide) patterning for BioMEMS/NEMS

Author

Castellanos, Abel ; Leffew, James ; Moreno, Wilfrido

Author_Institution

Fac. de Ing., Univ. Veracruzana, Veracruz

fYear

2008

fDate

28-30 April 2008

Firstpage

1

Lastpage

6

Abstract

Two techniques, focused ion beam patterning, (FIB), and electron-beam lithography, (E-beam), for micron and submicron patterning of cross-linked poly(N- isopropylacrylamide) films are presented. Both techniques generate well-defined patterns that retain their thermo-responsiveness. However, only FIB patterning combined with soft lithography offers independent control over cross-link density and feature-size resolution. In order to demonstrate the use of E-beam lithography a series of "smart" trenches were fabricated, which could be exploited for BioSamples capture and release mechanisms for BioMEMS/NEMS sample processing.

Keywords

bioMEMS; electron beam lithography; focused ion beam technology; polymer films; soft lithography; bioMEMS; bioNEMS; cross-link density; cross-linked poly(N- isopropylacrylamide) films; e-beam cross-linked poly(N-isopropylacrylamide) patterning; electron-beam lithography; feature-size resolution; focused ion beam patterning; smart trenches; soft lithography; submicron patterning; thermo-responsiveness; Atomic force microscopy; Lithography; Microfluidics; Nanoelectromechanical systems; Optical films; Optical microscopy; Plasma temperature; Polymers; Scanning electron microscopy; Surface topography; BioMEMS/NEMS; E-Beam Lithography; FIB; Hydrogel; PMMA; poly-NIPAAm;

fLanguage

English

Publisher

ieee

Conference_Titel

Devices, Circuits and Systems, 2008. ICCDCS 2008. 7th International Caribbean Conference on

Conference_Location

Cancun

Print_ISBN

978-1-4244-1956-2

Electronic_ISBN

978-1-4244-1957-9

Type

conf

DOI

10.1109/ICCDCS.2008.4542641

Filename

4542641