Thermal Model for Hand-Object Interactions

Author

Ho, Hsin-Ni ; Jones, Lynette A.

Author_Institution

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA e-mail: sineadho@mit.edu

fYear

2006

fDate

25-26 March 2006

Firstpage

461

Lastpage

467

Abstract

A thermal model is proposed that predicts the temperature responses of the skin and material surface during hand-object interactions as well as the heat flux exchanged when the fingerpad makes contact with an object. The surface features of the fingerpad were measured in order to estimate the thermal contact resistance which is included in the model. A simulation based on the model was performed to calculate the thermal responses of the fingerpad as it made contact with a range of materials with varying thermal properties. A thermal measurement system based on an infrared camera has been designed and fabricated to overcome the limitations imposed by the contact thermal sensors. This system will be used to evaluate the validity of the model in predicting the changes in skin temperature during contact.

Keywords

Fingerpad surface roughness; hand-object interaction; haptic interface; thermal contact resistance; thermal display; thermal feedback; thermal model; virtual environment; Cameras; Contact resistance; Electrical resistance measurement; Infrared sensors; Predictive models; Sensor systems; Skin; Surface resistance; Temperature; Thermal resistance; Fingerpad surface roughness; hand-object interaction; haptic interface; thermal contact resistance; thermal display; thermal feedback; thermal model; virtual environment;

fLanguage

English

Publisher

ieee

Conference_Titel

Haptic Interfaces for Virtual Environment and Teleoperator Systems, 2006 14th Symposium on

Print_ISBN

1-4244-0226-3

Type

conf

DOI

10.1109/HAPTIC.2006.1627108

Filename

1627108