Design and modeling of an RFIC pad structure and probe contact impedance correction for on-wafer measurements

Author

Capovilla, C.E. ; Tavora, A.S.A. ; Kretly, L.C.

Author_Institution

Dept. of Microwave & Opt., State Univ. of Campinas, Campinas

fYear

2008

fDate

28-30 April 2008

Firstpage

1

Lastpage

4

Abstract

This work describes the design and modeling of RF and ground pads as a GSG structure for on-wafer measurements. An equivalent circuit is proposed take into account ESD protection and the parasitic elements of the structure. The problem of the impedance contact between the microprobe and the GSG structure is also reported, as well as, results of an application using this structure on an LNA design. The concordance between the simulation results and the measured ones validates the model.

Keywords

CMOS integrated circuits; S-matrix theory; contact resistance; electrostatic discharge; field effect MMIC; integrated circuit design; integrated circuit modelling; microwave amplifiers; ESD protection; LNA design; RFIC PAD structure modeling; equivalent circuit; ground-signal-ground structure; on-wafer measurements; parasitic elements; probe contact impedance correction; Electrostatic discharge; Equivalent circuits; Foundries; Impedance measurement; Probes; Protection; RF signals; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Devices, Circuits and Systems, 2008. ICCDCS 2008. 7th International Caribbean Conference on

Conference_Location

Cancun

Print_ISBN

978-1-4244-1956-2

Electronic_ISBN

978-1-4244-1957-9

Type

conf

DOI

10.1109/ICCDCS.2008.4542646

Filename

4542646