Reducing cost and ensuring on-time delivery of hybrid-WSI massively parallel computing modules

Hybrid-WSI technologies offer an attractive implementation route for Massively Parallel Computing (MPC) Modules. However, cost and, especially, delivery problems, still associated with these technologies make MPC manufacturers wary. Uncertainties are mainly caused by limited individual die yields, and loss of good die during the mounting and bonding processes. Although significant research effort is aimed at supplying “known-good-die” and die yields can be expected to improve in the near future, these are likely to be superseded by increased levels of integration. This paper demonstrates how redundancy and reconfiguration can offer a solution to the problem and ensure on-time delivery while reducing the production cost of hybrid-WSI MPC modules significantly