DocumentCode :
1858307
Title :
Greater than 2-bits/cell MLC storage for ultra high density phase change memory using a novel sensing scheme
Author :
Wu, J.Y. ; Khwa, W.S. ; Lee, M.H. ; Li, H.P. ; Lai, S.C. ; Su, T.H. ; Wei, M.L. ; Wang, T.Y. ; BrightSky, M. ; Chen, T.S. ; Chien, W.C. ; Kim, S. ; Cheek, R. ; Cheng, H.Y. ; Lai, E.K. ; Zhu, Y. ; Lung, H.L. ; Lam, C.
Author_Institution :
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear :
2015
fDate :
16-18 June 2015
Abstract :
Multi-level-cell (MLC) is a critical technology to achieve low bit cost for phase change memory. However, resistance drift is an intrinsic material property that kills memory window and imposes formidable challenges for MLC. In this work, we report a radically different sensing concept that exploits the non-linear R-V characteristics of PCM that can easily accommodate 8 resistance levels in three independent 10X sensing windows (100KΩ~1MΩ × 3) all on same read speed. Each sensing window only needs to store 2~3 resistance levels instead of 8 levels needed in conventional MLC method, thus can tolerate resistance drift without closing the memory windows. A maximum of 16 levels of MLC is demonstrated on a 256Mb chip that is suitable for 4-bits/cell application.
Keywords :
phase change memories; MLC storage; memory windows; multi-level-cell; resistance drift; ultra high density phase change memory; Etching; Organizations; Phase change materials; Phase change memory; Resistance; Sensors; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSI Technology), 2015 Symposium on
Conference_Location :
Kyoto
ISSN :
0743-1562
Type :
conf
DOI :
10.1109/VLSIT.2015.7223706
Filename :
7223706
Link To Document :
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