• DocumentCode
    1858326
  • Title

    Low-cost maskless grayscale lithography using a new photo-definable polyimide for polymer MEMS applications

  • Author

    Lake, Joseph H. ; Walsh, Kevin M. ; McNamara, Shamus

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Louisville, Louisville, KY, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1889
  • Lastpage
    1891
  • Abstract
    We present the novel use of a positive-tone photosensitive polyimide for the rapid production of grayscale features using a maskless lithography system including several sample geometries to illustrate the general capabilities of this method. Commonly used in the fabrication of MEMS and other micro-scale devices, polyimide films are known for their extreme mechanical and thermal stability. Unfortunately, photo-definable polyimides historically have possessed significantly limiting critical properties, i.e. decreased elongation, low tensile strength and high film stresses. The use of a new polyimide, HD-8820, overcomes these limitations and allows direct patterning of polyimide into complex geometries without the need for imprinting, plasma etching or other secondary processing steps. The entire fabrication sequence, from CAD file to cured structure, can take only 4 hours making this a fast, low-cost method of producing polymer MEMS devices with excellent mechanical properties.
  • Keywords
    lithography; mechanical stability; microfabrication; micromechanical devices; polymers; thermal stability; CAD file; MEMS fabrication; high film stresses; imprinting; low tensile strength; low-cost maskless grayscale lithography; mechanical stability; microscale devices; photo-definable polyimide; plasma etching; polymer MEMS applications; positive-tone photosensitive polyimide film; thermal stability; Fabrication; Geometry; Gray-scale; Lithography; Micromechanical devices; Polyimides; Polymers; Production systems; Tensile stress; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285686
  • Filename
    5285686