DocumentCode
1858326
Title
Low-cost maskless grayscale lithography using a new photo-definable polyimide for polymer MEMS applications
Author
Lake, Joseph H. ; Walsh, Kevin M. ; McNamara, Shamus
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Louisville, Louisville, KY, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
1889
Lastpage
1891
Abstract
We present the novel use of a positive-tone photosensitive polyimide for the rapid production of grayscale features using a maskless lithography system including several sample geometries to illustrate the general capabilities of this method. Commonly used in the fabrication of MEMS and other micro-scale devices, polyimide films are known for their extreme mechanical and thermal stability. Unfortunately, photo-definable polyimides historically have possessed significantly limiting critical properties, i.e. decreased elongation, low tensile strength and high film stresses. The use of a new polyimide, HD-8820, overcomes these limitations and allows direct patterning of polyimide into complex geometries without the need for imprinting, plasma etching or other secondary processing steps. The entire fabrication sequence, from CAD file to cured structure, can take only 4 hours making this a fast, low-cost method of producing polymer MEMS devices with excellent mechanical properties.
Keywords
lithography; mechanical stability; microfabrication; micromechanical devices; polymers; thermal stability; CAD file; MEMS fabrication; high film stresses; imprinting; low tensile strength; low-cost maskless grayscale lithography; mechanical stability; microscale devices; photo-definable polyimide; plasma etching; polymer MEMS applications; positive-tone photosensitive polyimide film; thermal stability; Fabrication; Geometry; Gray-scale; Lithography; Micromechanical devices; Polyimides; Polymers; Production systems; Tensile stress; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285686
Filename
5285686
Link To Document