• DocumentCode
    1858518
  • Title

    Novel 3D force sensor using ultra-thin silicon strain gauge bonded on metal membrane

  • Author

    Kim, Y.D. ; Kim, Y.D. ; Lee, C.S. ; Kwon, S.J.

  • Author_Institution
    KAIST, Daejeon, South Korea
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1920
  • Lastpage
    1923
  • Abstract
    In the present paper, we propose a novel 3D force sensor design using a silicon strain gauge bonded on a metal diaphragm. The fabrication process and glass frit bonding process of the ultra-thin silicon strain gauges having a thickness of 50 mum were established; afterward, performance of the silicon strain gauge bonded on the stainless steel cantilever beam was evaluated at the various conditions. In results, resistance linearly increased with deformation by tensile stress, and gauge factor representing the sensitivity of the strain gauge was 33.77. Nonlinearity and hysteresis were respectively 0.21%FS and 0.17%FS.
  • Keywords
    bonding processes; cantilevers; deformation; diaphragms; elemental semiconductors; force sensors; hysteresis; membranes; semiconductor devices; silicon; strain gauges; 3D force sensor; Si; cantilever beam; deformation; fabrication process; gauge factor; glass frit bonding process; hysteresis; metal diaphragm; metal membrane; size 50 mum; strain gauge sensitivity; tensile stress; ultrathin silicon strain gauge; Biomembranes; Bonding forces; Bonding processes; Capacitive sensors; Fabrication; Force sensors; Glass; Silicon; Steel; Structural beams; 3D force sensor; MEMS strain gauge; Poly-Si strain gauge; glass frit bonding; ultra-thin strain gauge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285694
  • Filename
    5285694