Title :
Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)
Abstract :
The following topics were dealt with: applications; yield assessment; reconfiguration; WSI evolution; testability; physical issues
Keywords :
VLSI; circuit CAD; circuit layout CAD; integrated circuit technology; integrated circuit testing; WSI evolution; physical issues; reconfiguration; testability; wafer scale integration; yield assessment;
Conference_Titel :
Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-1850-1
DOI :
10.1109/ICWSI.1994.291267
