DocumentCode
1859425
Title
Thermal characteristics of a Ka-band planar helix slow-wave structure
Author
Shaomeng Wang ; Chen Zhao ; Aditya, Sheel ; Ciersiang Chua
Author_Institution
Satellite Res. Center, Nanyang Technol. Univ., Singapore, Singapore
fYear
2015
fDate
27-29 April 2015
Firstpage
1
Lastpage
2
Abstract
The thermal analysis of a Ka-band slow-wave structure (SWS) consisting of a planar helix with straight edge connections (PH-SEC) has been carried out using CST as well as ANSYS. The thermal loss of the PH-SEC is calculated first and is used as the heat source in the thermal analysis. The temperature profile and the maximum temperature as a function of the dissipated power have been obtained. It is shown that the maximum temperature for the planar helix SWS is significantly lower than that for a corresponding conventional circular helix.
Keywords
slow wave structures; thermal analysis; Ka-band slow wave structure; dissipated power; maximum temperature; planar helix slow wave structure; straight edge connections; temperature profile; thermal analysis; Copper; Finite element analysis; Silicon; microfabrication; slow-wave structure; thermal analysis; thermal contact resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2015 IEEE International
Conference_Location
Beijing
Print_ISBN
978-1-4799-7109-1
Type
conf
DOI
10.1109/IVEC.2015.7223758
Filename
7223758
Link To Document