Title :
Interconnect Built-In Self-Repair and Adaptive-Serialization (I-BIRAS) for 3D integrated systems
Author :
Nicolaidis, M. ; Pasca, Vladimir ; Anghel, Lorena
Author_Institution :
TIMA Lab., UJF, Grenoble, France
Abstract :
The high defect rates of the TSV manufacturing processes lead to poor yield. Interconnect repair and serialization techniques were proposed to improve yield. In these papers the control of the repair and serialization circuitry are determined off-chip and are stored in one-time-programmable memories. In this work we present an Interconnect Built-in Self-Repair and Adaptive-Serialization approach (I-BIRAS), where interconnect repair and data serialization/deserialization is performed without external intervention (reducing cost of external equipment) and can be executed at any time (after fabrication and all along system life), thus coping with both fabrication and system-life defects.
Keywords :
integrated circuit interconnections; integrated circuit testing; three-dimensional integrated circuits; 3D integrated system; I-BIRAS; TSV manufacturing process; data deserialization; data serialization; defect rate; fabrication defect; interconnect built-in self-repair and adaptive-serialization; off-chip; one-time-programmable memory; serialization circuitry; system-life defect; Circuit faults; Computer architecture; Fault tolerance; Integrated circuit interconnections; Maintenance engineering; Registers; Three dimensional displays;
Conference_Titel :
On-Line Testing Symposium (IOLTS), 2010 IEEE 16th International
Conference_Location :
Corfu
Print_ISBN :
978-1-4244-7724-1
DOI :
10.1109/IOLTS.2010.5560198