DocumentCode
1859842
Title
An accurate RF package model for RFIC design
Author
Lin, Fujiang ; Cao, Jiang ; Singh, Rajinder ; Nakamura, Hiroshi
Author_Institution
HP EEs of Solution Services, Singapore Microelectron. Modeling Center, Singapore
Volume
3
fYear
1999
fDate
1999
Firstpage
952
Abstract
A CAD-oriented scaleable equivalent circuit model representing RF package leads and bond wires is presented. Skin effect and frequency dispersion are included making model valid above resonance frequency. Model parameters are extracted from real-world accurate S-parameter probing and data-fitting process. Ground inductance of bond wire arrays insides a plastic package is also characterized and analyzed. The package model has been well validated by a series of RFIC designs with all first-pass success
Keywords
S-parameters; equivalent circuits; integrated circuit design; integrated circuit packaging; plastic packaging; skin effect; CAD; RF package model; RFIC design; S-parameter; bond wire array; equivalent circuit; frequency dispersion; ground inductance; parameter extraction; plastic package; skin effect; Bonding; Dispersion; Equivalent circuits; Packaging; Radio frequency; Radiofrequency integrated circuits; Resonance; Resonant frequency; Skin effect; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1999 Asia Pacific
Print_ISBN
0-7803-5761-2
Type
conf
DOI
10.1109/APMC.1999.833753
Filename
833753
Link To Document