Title :
Thermal coupling in ICs: Applications to the test and characterization of analogue and RF circuits
Author :
Altet, Josep ; Mateo, Diego ; Aldrete-Vidrio, Eduardo
Author_Institution :
Electron. Eng. Dept., Univ. Politec. de Catalunya, Barcelona, Spain
Abstract :
In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits.
Keywords :
analogue integrated circuits; frequency measurement; integrated circuit testing; radiofrequency integrated circuits; temperature measurement; DC temperature measurement; RF circuit; figures of merit; high frequency analogue circuit; integrated circuit testing; low frequency measurement; thermal coupling; Couplings; Electric variables measurement; Frequency conversion; Frequency measurement; Integrated circuits; Temperature measurement; Temperature sensors;
Conference_Titel :
On-Line Testing Symposium (IOLTS), 2010 IEEE 16th International
Conference_Location :
Corfu
Print_ISBN :
978-1-4244-7724-1
DOI :
10.1109/IOLTS.2010.5560220
