DocumentCode :
1860332
Title :
In-situ formation of an ion-doped porous structure for high sensitive humidity sensing utilizing low-cost UV sensitive glue
Author :
Chen, Ching-Hsiu ; Hung, Chia-Wei ; Lin, Che-Hsin
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1694
Lastpage :
1697
Abstract :
This paper presents a novel method for in-situ formation of an ion-doped porous structure for high sensitive humidity sensing utilizing low-cost UV sensitive epoxy. Nano-size granular polymer structures can be directly deposited on a substrate by exposing a UV sensitive epoxy in an organic solvent of alcohol. SEM observations indicate that the deposited porous structure is constructed by stacking polymer nano-particles of around 300 nm in size. A deliquescence salt of MgCl2 is simultaneously introduced into the porous sensing layer for enhancing the vapor absorption ability during the polymerization process. Results show that the sensitivity of the humidity sensor with the ion-doped porous structure is enhanced over 365 times greater than the sensor fabricated with the same material without ion-doped porous structure. The proposed method provides a simple and fast way to fabricated high performance humidity sensors.
Keywords :
granular structure; humidity sensors; nanoparticles; polymerisation; polymers; porous materials; scanning electron microscopy; SEM; deliquescence salt; high sensitive humidity sensor; ion-doped porous structure; low-cost UV sensitive glue; nanosize granular polymer structures; polymerization process; porous sensing layer; vapor absorption ability; Absorption; Chemical processes; Chemical sensors; Epoxy resins; Glass; Humidity; Nanostructures; Polymer films; Solvents; Substrates; UV-glue; deliquescence salt; humidity sensor; porosity; porous structure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285758
Filename :
5285758
Link To Document :
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