• DocumentCode
    1860857
  • Title

    Measurement and evaluation of sitting comfort of automotive seat

  • Author

    Tada, M. ; Sekiguchi, S. ; Nisimatsu, T. ; Toba, E.

  • Author_Institution
    Fac. of Textile Sci. & Technol., Shinshu Univ., Nagano, Japan
  • Volume
    1
  • fYear
    1998
  • fDate
    18-21 May 1998
  • Firstpage
    316
  • Abstract
    The sitting comfort of six automotive seats, whose top coated fabrics were changed and structures of seats were same, was evaluated by only human tactile sensation while sitting on these seats. The objectives used for the sensory evaluation of seat comfort by the human tactile sensation were examined by factor analysis. As the result of factor analysis, two adjectives high-class and “thick” were common and significant in evaluating the seat comfort. But adjective “sporty” was not influenced by the top coated fabrics of seat. Further a pressure and a contact area distribution between the human body and the seat were measured by a tactile sensor system while sitting on six seats. From the result of correlation analysis between the pressure distribution and the sensory values, it is found that the pressure and the contact area between the back-rest and human back was correlated with “high-class”, and that the contact area between the seat cushion and human buttocks was correlated with “thick”
  • Keywords
    automobiles; computerised instrumentation; correlation methods; human factors; pressure measurement; pressure sensors; tactile sensors; automotive seat; correlation analysis; factor analysis; human buttocks; human tactile sensation; pressure; pressure distribution; seat cushion; sensory evaluation; sitting comfort; tactile sensor; top coated fabrics; Area measurement; Automobiles; Automotive engineering; Buttocks; Fabrics; Humans; Pressure measurement; Shape measurement; Tactile sensors; Textile technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1998. IMTC/98. Conference Proceedings. IEEE
  • Conference_Location
    St. Paul, MN
  • ISSN
    1091-5281
  • Print_ISBN
    0-7803-4797-8
  • Type

    conf

  • DOI
    10.1109/IMTC.1998.679792
  • Filename
    679792