• DocumentCode
    1861068
  • Title

    Accurate broadband parameter extraction methodology for S-parameter measurements

  • Author

    Balachandran, J. ; Brebels, S. ; Carchon, G. ; Raedt, W. De ; Nauwelaers, B. ; Beyne, E.

  • Author_Institution
    Microwave & RF Syst. Group, IMEC, Leuven, Belgium
  • fYear
    2005
  • fDate
    10-13 May 2005
  • Firstpage
    57
  • Lastpage
    60
  • Abstract
    GHz range operating frequencies of today´s semiconductor devices demand accurate interconnect models. Constructing accurate and scalable models require extraction of interconnect parameters namely resistance-R, inductance-L, capacitance-C and conductance-G from measured S-parameters. The parameter extraction is error prone influenced by half-wavelength resonance. In this paper, we present a new methodology for accurately extracting interconnect parameters from measured S-parameters. We first analyze the parameter extraction errors and show that it can be mainly attributed to non-perfect de-embedding. Based on the error analysis, we derive an extraction flow for accurate interconnect characterization. The proposed method is validated with fabricated transmission line test structures. Extracted line parameters agree with well-known theoretical models, establishing accuracy of the method.
  • Keywords
    S-parameters; integrated circuit interconnections; integrated circuit modelling; microwave measurement; S-parameter measurements; broadband parameter extraction methodology; capacitance; conductance; half-wavelength resonance; inductance; interconnect parameter extraction; nonperfect de-embedding; parameter extraction errors; resistance; semiconductor devices; transmission line; Capacitance measurement; Electrical resistance measurement; Error analysis; Frequency; Parameter extraction; Resonance; Scattering parameters; Semiconductor devices; Transmission line measurements; Transmission line theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
  • Print_ISBN
    0-7803-9054-7
  • Type

    conf

  • DOI
    10.1109/SPI.2005.1500897
  • Filename
    1500897