Experimental study of thermal contact resistance between AlN and Kovar alloy by laser flash method

Author

Zhang Lin ; Lu Yan-ping ; Du Bin

Author_Institution

Beijing Vacuum Electron. Res. Inst., Beijing, China

fYear

2015

fDate

27-29 April 2015

Firstpage

1

Lastpage

2

Abstract

In this paper, the thermal contact resistance of solid interface between AlN and Kovar alloy and some main influencing factors of it were investigated. The thermal contact resistance of the interface between AlN ceramic and Kovar alloy decreases with increasing temperature and increasing pressure respectively, and thermal contact resistance between the unpolished samples is higher than that between polished samples. A function relation between pressure P applied on the AlN ceramic and Kovar alloy interface and the thermal contact resistance R is also presented.

Keywords

III-V semiconductors; aluminium compounds; contact resistance; laser materials processing; measurement by laser beam; thermal analysis; thermal resistance measurement; AlN; Kovar alloy; ceramic; laser flash method; thermal contact resistance; Aluminum nitride; Ceramics; Contact resistance; III-V semiconductor materials; Temperature measurement; Thermal resistance; AlN; Kovar alloy; laser flash method; thermal contact resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference (IVEC), 2015 IEEE International

Conference_Location

Beijing

Print_ISBN

978-1-4799-7109-1

Type

conf

DOI

10.1109/IVEC.2015.7223827

Filename

7223827