DocumentCode
1861294
Title
Characterizations of interconnects formed in electromagnetic bandgap substrates
Author
Suntives, Asanee ; Abhari, Ramesh
Author_Institution
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
fYear
2005
fDate
10-13 May 2005
Firstpage
75
Lastpage
78
Abstract
In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.
Keywords
integrated circuit interconnections; microstrip lines; photonic band gap; electromagnetic bandgap substrate; interconnect geometries; microstrip lines; single interconnect; Cutoff frequency; Electromagnetic interference; Electromagnetic propagation; Electromagnetic waveguides; Geometry; Integrated circuit interconnections; Metamaterials; Microstrip; Periodic structures; Prototypes;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
Print_ISBN
0-7803-9054-7
Type
conf
DOI
10.1109/SPI.2005.1500903
Filename
1500903
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