DocumentCode :
1861419
Title :
Analysis of interconnects in huge frequency ranges with a 3-D superficial integral formulation
Author :
Chiariello, A.G. ; Maffucci, Antonio ; Miano, Giovanni ; Villone, Fabio ; Zamboni, Walter
Author_Institution :
DIEL, Universita degli Studi di Napoli Federico II, Italy
fYear :
2005
fDate :
10-13 May 2005
Firstpage :
89
Lastpage :
92
Abstract :
A general method is proposed to analyze interconnects with perfect conductors and homogeneous dielectrics, which is valid from zero frequency to microwave frequencies. In this method, facet elements have been used to represent the current density field. To overcome the low-frequency breakdown problem, the divergence-free and non divergence-free components of the current density field are separated by using the and pseudo inverse of the matrix approximating the divergence operator.
Keywords :
conductors (electric); current density; dielectric materials; integral equations; integrated circuit interconnections; matrix inversion; 3D superficial integral formulation; current density; divergence operator; divergence-free component; homogeneous dielectrics; interconnect analysis; matrix approximation; matrix inverse; microwave frequency; perfect conductors; pseudo matrix inverse; zero frequency; Conductors; Coupling circuits; Current density; Dielectrics; Electric breakdown; Electromagnetic coupling; Electromagnetic radiation; Integrated circuit interconnections; Microwave frequencies; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
Print_ISBN :
0-7803-9054-7
Type :
conf
DOI :
10.1109/SPI.2005.1500908
Filename :
1500908
Link To Document :
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