Analysis of interconnects in huge frequency ranges with a 3-D superficial integral formulation

Author

Chiariello, A.G. ; Maffucci, Antonio ; Miano, Giovanni ; Villone, Fabio ; Zamboni, Walter

Author_Institution

DIEL, Universita degli Studi di Napoli Federico II, Italy

fYear

2005

fDate

10-13 May 2005

Firstpage

89

Lastpage

92

Abstract

A general method is proposed to analyze interconnects with perfect conductors and homogeneous dielectrics, which is valid from zero frequency to microwave frequencies. In this method, facet elements have been used to represent the current density field. To overcome the low-frequency breakdown problem, the divergence-free and non divergence-free components of the current density field are separated by using the and pseudo inverse of the matrix approximating the divergence operator.

Keywords

conductors (electric); current density; dielectric materials; integral equations; integrated circuit interconnections; matrix inversion; 3D superficial integral formulation; current density; divergence operator; divergence-free component; homogeneous dielectrics; interconnect analysis; matrix approximation; matrix inverse; microwave frequency; perfect conductors; pseudo matrix inverse; zero frequency; Conductors; Coupling circuits; Current density; Dielectrics; Electric breakdown; Electromagnetic coupling; Electromagnetic radiation; Integrated circuit interconnections; Microwave frequencies; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on

Print_ISBN

0-7803-9054-7

Type

conf

DOI

10.1109/SPI.2005.1500908

Filename

1500908