DocumentCode :
1861877
Title :
Quality factor enhancement in micromechanical resonators at cryogenic temperatures
Author :
Li, Wei-Chang ; Lin, Yang ; Kim, Bongsang ; Ren, Zeying ; Nguyen, Clark T C
Author_Institution :
Dept. of EECS, Univ. of California at Berkeley, Berkeley, CA, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1445
Lastpage :
1448
Abstract :
Quality factors as high as 362,768 have been measured for 61-MHz polysilicon wine-glass disk micromechanical resonators operated at cryogenic temperatures down to 5K. The measured results not only represent a ~2.5times increase in Q over the room temperature value, equivalent to a nearly 10-dB improvement in phase noise; but also provide some limited insight into the intrinsic material damping and other loss mechanisms that dominate over certain temperature ranges. In particular, a measured Q versus temperature curve verifies a peaking point for phonon-phonon interaction losses at a temperature around 150K. In addition, measurement versus theory for resonators with different support designs suggests that anchor losses probably still dominate the Q´s of the resonators over the entire measured temperature range, implying that improved anchor isolating designs are needed if the true intrinsic material Q´s of polysilicon are to be measured at cryogenic temperatures.
Keywords :
Q-factor; cryogenics; micromechanical resonators; phonon-phonon interactions; cryogenic temperature; micromechanical resonator; phonon-phonon interaction; polysilicon; quality factor enhancement; Cryogenics; Loss measurement; Micromechanical devices; Noise measurement; Phase measurement; Phase noise; Q factor; Q measurement; Temperature distribution; Temperature measurement; RF MEMS; Resonator; cryogenic cooling; filter; loss; oscillator; quality factor; wireless communications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285815
Filename :
5285815
Link To Document :
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