• DocumentCode
    1861877
  • Title

    Quality factor enhancement in micromechanical resonators at cryogenic temperatures

  • Author

    Li, Wei-Chang ; Lin, Yang ; Kim, Bongsang ; Ren, Zeying ; Nguyen, Clark T C

  • Author_Institution
    Dept. of EECS, Univ. of California at Berkeley, Berkeley, CA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1445
  • Lastpage
    1448
  • Abstract
    Quality factors as high as 362,768 have been measured for 61-MHz polysilicon wine-glass disk micromechanical resonators operated at cryogenic temperatures down to 5K. The measured results not only represent a ~2.5times increase in Q over the room temperature value, equivalent to a nearly 10-dB improvement in phase noise; but also provide some limited insight into the intrinsic material damping and other loss mechanisms that dominate over certain temperature ranges. In particular, a measured Q versus temperature curve verifies a peaking point for phonon-phonon interaction losses at a temperature around 150K. In addition, measurement versus theory for resonators with different support designs suggests that anchor losses probably still dominate the Q´s of the resonators over the entire measured temperature range, implying that improved anchor isolating designs are needed if the true intrinsic material Q´s of polysilicon are to be measured at cryogenic temperatures.
  • Keywords
    Q-factor; cryogenics; micromechanical resonators; phonon-phonon interactions; cryogenic temperature; micromechanical resonator; phonon-phonon interaction; polysilicon; quality factor enhancement; Cryogenics; Loss measurement; Micromechanical devices; Noise measurement; Phase measurement; Phase noise; Q factor; Q measurement; Temperature distribution; Temperature measurement; RF MEMS; Resonator; cryogenic cooling; filter; loss; oscillator; quality factor; wireless communications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285815
  • Filename
    5285815