DocumentCode :
1862013
Title :
Respective parts of capacitive and inductive coupling
Author :
Deschacht, D.
Author_Institution :
Lab. d´´Informatique, de Robotique et de Microelectronique de Montpellier, UMR CNRS, Montpellier, France
fYear :
2005
fDate :
10-13 May 2005
Firstpage :
163
Lastpage :
166
Abstract :
Rapid progress in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. In this paper we show the influence of inductance on crosstalk voltage by considering a configuration of two parallel coupled interconnects. For a typical DSM (deep-sub-micron) geometry structure for data buses, we show that when standard distributed RC models are used and inductive effects are ignored, large errors can occur in the prediction and evaluation of the crosstalk voltage. This is all the more important because the inductance effect will increase as technologies downscale. For our structure, the inductive part of crosstalk can reach 30% when the input transition time at the beginning of the aggressor line is 50ps. The sensibility of inductances values, including self and mutual inductances are then analysed.
Keywords :
capacitance; coupled circuits; inductance; integrated circuit interconnections; capacitive coupling; crosstalk voltage; digital chips; distributed RC models; inductance effect; inductive coupling; integrated circuit technology; mutual inductance; parallel coupled interconnects; self inductance; signal lines; switching speed; Coupling circuits; Crosstalk; Data buses; Geometry; Inductance; Integrated circuit interconnections; Integrated circuit technology; Solid modeling; Switching circuits; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
Print_ISBN :
0-7803-9054-7
Type :
conf
DOI :
10.1109/SPI.2005.1500934
Filename :
1500934
Link To Document :
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