Title :
Interaction of redistribution traces with on-wafer interconnects in memory chip packaging
Author :
Gospodinova, M. ; Ktata, M.F. ; Koellermeyer, J. ; Nan, G. ; Vogl, M. ; Thomas, J.
Author_Institution :
Memory Products Div., Infineon Technol., Munich, Germany
Abstract :
In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.
Keywords :
frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; integrated memory circuits; time-domain analysis; electromagnetic interaction; frequency domain; memory chip packaging; on-wafer interconnects; redistribution traces; time domain; Bonding; Data mining; Electromagnetic fields; Frequency; Magnetic properties; Manufacturing; Packaging; Product design; Semiconductor device modeling; Solid modeling;
Conference_Titel :
Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
Print_ISBN :
0-7803-9054-7
DOI :
10.1109/SPI.2005.1500936
