DocumentCode :
1862120
Title :
In-situ measurement of variability in 45-nm SOI embedded DRAM arrays
Author :
Agarwal, Kanak ; Hayes, Jerry ; Barth, John ; Jacunski, Mark ; Nowka, Kevin ; Kirihata, Toshiaki ; Iyer, Subramanian
Author_Institution :
IBM Res., Austin, TX, USA
fYear :
2010
fDate :
16-18 June 2010
Firstpage :
189
Lastpage :
190
Abstract :
A technique for in-situ measurement of process variation in deep trench capacitance, bitline capacitance, and device threshold voltage in embedded DRAM arrays is presented. The technique is used to directly measure the parameter statistics in two product representative 45-nm SOI eDRAM arrays.
Keywords :
DRAM chips; capacitance; silicon-on-insulator; SOI embedded DRAM arrays; bitline capacitance; deep trench capacitance; device threshold voltage; in-situ measurement; process variation; size 45 nm; Arrays; Capacitance; Capacitance measurement; Microprocessors; Random access memory; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Circuits (VLSIC), 2010 IEEE Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-5454-9
Type :
conf
DOI :
10.1109/VLSIC.2010.5560302
Filename :
5560302
Link To Document :
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