• DocumentCode
    1862127
  • Title

    Accurate CIGS composition measurements using surface analytical techniques

  • Author

    Mount, Gary ; Moskito, John ; Sharma, Udit ; Strossman, Greg ; Wang, Larry ; Schnabel, Patrick ; Buyuklimanli, Temel ; Putyera, Karol

  • Author_Institution
    Evans Anal. Group, Sunnyvale, CA, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    Conversion efficiency for Cu(Inx, Ga1-x)Se2 is dependent on a number of factors including band-gap and defect structures. Material composition affects band gap and it affects the formation of defect structures. A fundamental understanding of the relationship between material composition, band gap and defect structures requires that the composition measurement be accurate. Accuracy is required for really explaining how and why the cells function. Why certain defect levels form as a function of concentration, and how the influence of defects is mitigated by compensation from other defects, also dependent on the composition. [1] In this work we will look at the accuracy of a number of analytical techniques. We evaluate strengths and limitations of each for reporting useful information on thin film CIGS materials and evaluate them for accuracy in reporting CIGS composition.
  • Keywords
    Auger electron spectra; Raman spectra; copper compounds; gallium compounds; indium compounds; selenium compounds; semiconductor thin films; ternary semiconductors; Auger spectroscopy; CIGS composition measurements; Cu(InxGa1-x)Se2; ICP-MS; RBS; Raman spectroscopy; SIMS; STEM-EDS; XRD; XRF; band-gap structures; conversion efficiency; defect structures formation; material composition affects; surface analytical techniques; thin film CIGS materials; Accuracy; Atomic measurements; Copper; Standards; Substrates; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186198
  • Filename
    6186198