• DocumentCode
    1862254
  • Title

    Integrated low-loss passive SiGe power splitter and combiner operating across 78–86 GHz band

  • Author

    Thian, Mury ; Fusco, Vincent ; Buchanan, N. ; Dielacher, Franz

  • Author_Institution
    ECIT Inst., Queen´s Univ. Belfast, Belfast, UK
  • fYear
    2013
  • fDate
    Sept. 30 2013-Oct. 3 2013
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    This paper describes the design, implementation, and characterization of a new type of passive power splitting and combining structure for use in a differential four-way power-combining amplifier operating at E-band. In order to achieve lowest insertion loss, input and output coils inductances are resonated with shunt capacitances. Simple C-L-C and L-C networks are proposed in order to compensate inductive loading due to routing line that would otherwise introduce mismatch and increase loss. Across 78-86 GHz band, measured insertion loss is about 7 dB. Measured return losses are >10 dB from 73 GHz to 94 GHz at the input port and >9 dB from 60 GHz to 94 GHz at the output port. When integrated with driver and power amplifier cells, the simulated complete circuit exhibits 18.2 dB gain and 20.3 dBm saturated output power.
  • Keywords
    Ge-Si alloys; millimetre wave power amplifiers; power combiners; power dividers; semiconductor materials; C-L-C networks; E-band; L-C networks; SiGe; differential four-way power-combining amplifier; driver; frequency 73 GHz to 94 GHz; gain 18.2 dB; inductive loading compensation; input-output coil inductance; insertion loss; integrated low-loss passive power splitter; passive power splitting; power amplifier cells; power combiner; shunt capacitances; Coils; Gain; Insertion loss; Loss measurement; Ports (Computers); Power amplifiers; Power generation; Balun; E-band; MMIC; SiGe; millimeter-wave; power amplifier; power combiner; power splitter; transformer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
  • Conference_Location
    Bordeaux
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4799-0126-5
  • Type

    conf

  • DOI
    10.1109/BCTM.2013.6798150
  • Filename
    6798150