• DocumentCode
    1862327
  • Title

    Highly-reliable and reproducible InGaAs/InP double heterojunction bipolar transistor utilizing all-wet etching process for triple mesa formation

  • Author

    Yanagisawa, M. ; Watanabe, Manabu ; Kawasaki, T. ; Kobayashi, Hideo ; Kotani, Koji ; Yamabi, Ryuji ; Tosaka, Yasuhiro ; Fukushi, Daiji

  • Author_Institution
    Transm. Devices R & D Labs., Sumitomo Electr. Ind., Ltd., Yokohama, Japan
  • fYear
    2013
  • fDate
    Sept. 30 2013-Oct. 3 2013
  • Firstpage
    97
  • Lastpage
    100
  • Abstract
    The authors have succeeded in making a robust fabrication process applied to InP-based double heterojunction bipolar transistors. The process, featuring all-wet etching method for formation of triple-mesa structure, has shown markedly high reproducibility and reliability. The variation of the current gain has been 4.6% through 130 wafers, and the mean time to failure at the junction temperature of 100°C has been longer than 4 × 106 hours, whose criterion is a 5% change in current gain. These excellent results show that our structure of DHBT, which has an InP passivation layer on the surface of the base layer, and our all-wet mesa formation process, are sufficient to be applied to the manufacturing of integrated circuits.
  • Keywords
    III-V semiconductors; etching; gallium arsenide; heterojunction bipolar transistors; indium compounds; semiconductor device reliability; wide band gap semiconductors; DHBT; InGaAs-InP; all-wet etching process; double heterojunction bipolar transistors; integrated circuits; passivation layer; robust fabrication process; temperature 100 degC; triple mesa formation; Current density; Etching; Films; Indium gallium arsenide; Indium phosphide; Passivation; Reliability; heterojunction bipolar transistor; manufacturability; reliability; reproducibility; wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
  • Conference_Location
    Bordeaux
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4799-0126-5
  • Type

    conf

  • DOI
    10.1109/BCTM.2013.6798153
  • Filename
    6798153