DocumentCode
1862354
Title
ASEAN-EU University Network Programme on EMC and SI education
Author
Canavero, F.G. ; Christopoulos, C. ; Grabinski, H. ; Yak, See Kye ; Khan-ngern, Werachet
Author_Institution
Politecnico di Torino, Italy
fYear
2005
fDate
10-13 May 2005
Firstpage
217
Lastpage
218
Abstract
This paper reports about a project for the creation of an innovative university course devoted to the preparation of future electronic designers to the challenges imposed by the assurance of the electrical performance of high-speed electronic systems. The target groups are future university teaching staff and future electronic systems designers. Activities are developed by means of sharing research results, seminars, experience exchange and the development of demonstrators to be used for teaching. The partnership is composed by Technical University of Turin (Italy), University of Hannover (Germany), University of Nottingham (UK), Nanyang Technological University (Singapore) and King Monguts Institute of Technology Lad-krabang, Bangkok (Thailand). The program is partially funded by the European Commission under the ASEAN-EU University Network Programme (AUNP) and its duration is 24 months.
Keywords
educational courses; educational institutions; electromagnetic compatibility; electronic engineering education; further education; teaching; ASEAN-EU University Network Programme; EMC education; European Commission; King Monguts Institute of Technology Lad-krabang; Nanyang Technological University; SI education; Technical University of Turin; University of Hannover; University of Nottingham; electrical performance; electromagnetic compatibility; electronic systems designers; high-speed electronic systems; university education; university teaching staff; Collaboration; Consumer electronics; Education; Educational programs; Electromagnetic compatibility; Electronics industry; Frequency; High-speed electronics; Seminars; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
Print_ISBN
0-7803-9054-7
Type
conf
DOI
10.1109/SPI.2005.1500949
Filename
1500949
Link To Document