DocumentCode :
1862356
Title :
GaN RF device technology and applications, present and future
Author :
Green, Bruce ; Moore, Kevin ; Hill, D. ; CdeBaca, Monica ; Schultz, Jamie
Author_Institution :
RF, Freescale Semicond., Tempe, AZ, USA
fYear :
2013
fDate :
Sept. 30 2013-Oct. 3 2013
Firstpage :
101
Lastpage :
106
Abstract :
Over the last decade, Gallium Nitride (GaN) has emerged as a mainstream RF technology with disruptive performance potential. Here, we present GaN technology in the context of current commercial RF communications applications as well as future applications. We show state of the art >200W, >75% efficient packaged device performance at 2.14 GHz using a 0.6 μm 48 V technology and apply the device technology to a 400 W ultra-small footprint Doherty power amplifier. We also describe extending the 0.6 μm technology to a 0.2 μm gate length that allows for higher fT that will enable future technology for high-efficiency switch-mode amplifiers.
Keywords :
III-V semiconductors; UHF power amplifiers; gallium compounds; wide band gap semiconductors; GaN; RF device technology; commercial RF communications applications; frequency 2.14 GHz; high-efficiency switch-mode amplifiers; power 400 W; size 0.2 mum; size 0.6 mum; ultra-small footprint Doherty power amplifier; voltage 48 V; Gain; Gallium nitride; HEMTs; Logic gates; MODFETs; Performance evaluation; Radio frequency; GaN; Power Amplifier; SiC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
Conference_Location :
Bordeaux
ISSN :
1088-9299
Print_ISBN :
978-1-4799-0126-5
Type :
conf
DOI :
10.1109/BCTM.2013.6798154
Filename :
6798154
Link To Document :
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