Title :
A 92 mW, 20 dB gain, broadband lumped SiGe amplifier with bandwidth exceeding 67 GHz
Author :
Zhe Xuan ; Ran Ding ; Baehr-Jones, Tom ; Hochberg, Michael
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA
fDate :
Sept. 30 2013-Oct. 3 2013
Abstract :
A compact, power-efficient broadband amplifier is demonstrated in a 0.13-micron SiGe BiCMOS process. The amplifier uses a lumped design topology with a shunt-feedback Darlington input stage and an emitter-follower buffered cascode post-amplifier stage. The overall amplifier consumes 92 mW DC power, and exhibits 20-dB gain. The reported 67-GHz bandwidth is limited by available test equipment, and the post-extraction simulated 3-dB bandwidth is 82 GHz, which implies a gain-bandwidth (GBW) of 820 GHz. The amplifier features a low group delay variation to enable high data rate. The post-extraction simulated group delay is 13+/-2 ps from 1 GHz to 100 GHz. The chip occupies an area of 0.28 mm2 including pads, and the core area is only 0.04 mm2, which includes all active devices and peaking inductors. This amplifier shows a figure-of-merit GBW/Pdc of 7.3 and 8.9 GHz/mW, assuming bandwidth of 67 GHz and 82 GHz respectively, which are among the best results to date.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; feedback amplifiers; field effect MIMIC; low-power electronics; lumped parameter networks; millimetre wave amplifiers; wideband amplifiers; GBW; SiGe; SiGe BiCMOS process; active devices; compact power-efficient broadband amplifier; emitter-follower buffered cascode post-amplifier stage; frequency 1 GHz to 100 GHz; frequency 67 GHz; frequency 82 GHz; gain 20 dB; gain-bandwidth; low group delay variation; lumped design topology; peaking inductors; post-extraction; power 92 mW; shunt-feedback Darlington input stage; size 0.13 mum; Bandwidth; Broadband amplifiers; Delays; Gain; Impedance; Inductors; Silicon germanium; BiCMOS integrated circuits; SiGe HBT; broadband amplifiers; millimeter-wave amplifiers; millimeter-wave integrated circuits;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4799-0126-5
DOI :
10.1109/BCTM.2013.6798155