DocumentCode :
1862484
Title :
InP HBT technology and modeling
Author :
Hitko, Donald A. ; Li, James C.
Author_Institution :
Microelectron. Lab.., HRL Labs. LLC, Malibu, CA, USA
fYear :
2013
fDate :
Sept. 30 2013-Oct. 3 2013
Firstpage :
123
Lastpage :
126
Abstract :
InP HBT technologies have reached a level of maturity where mixed-signal ICs with 1000s of transistors have become fairly routine in a regime where high speed, low jitter, and high dynamic range are discriminators, necessitating simulator-efficient compact model representations covering a range of device sizes and all operating modes. In comparison to the more traditional graded-base SiGe bipolar devices, InP HBTs have a number of traits that make them unique from a modeling perspective. An overview of InP HBT device characteristics is presented, along with highlights of a comprehensive device characterization and modeling strategy implemented to support the development of a scalable compact model based on VBIC for the design of high-speed mixed-signal circuits.
Keywords :
Ge-Si alloys; III-V semiconductors; heterojunction bipolar transistors; indium compounds; jitter; mixed analogue-digital integrated circuits; semiconductor device models; InP; SiGe; VBIC; bipolar devices; device characterization; high-speed mixed-signal integrated circuits; semiconductor device models; Capacitance; Heterojunction bipolar transistors; Indium phosphide; Integrated circuit modeling; Resistance; Semiconductor device modeling; Heterojunction Bipolar Transistors (HBTs); InP; modeling; simulation; thermal;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
Conference_Location :
Bordeaux
ISSN :
1088-9299
Print_ISBN :
978-1-4799-0126-5
Type :
conf
DOI :
10.1109/BCTM.2013.6798159
Filename :
6798159
Link To Document :
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