DocumentCode :
1862543
Title :
Encapsulated out-of-plane differential square-plate resonator with integrated actuation electrodes
Author :
Chen, Kuan-Lin ; Wang, Shasha ; Salvia, James ; Howe, Roger T. ; Kenny, Thomas W.
Author_Institution :
Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1421
Lastpage :
1424
Abstract :
This paper presents a fully encapsulated 12.5 MHz transverse-mode differential square plate resonator that has out-of-plane actuation electrodes integrated into the thin-film microshell encapsulation. The integration of electrodes minimizes the parasitic resistance, which is generally large for out-of-plane device, and the total footprint of the resonator. Feedthrough capacitance is also minimized by utilizing a differential topology. The AC power handling and DC tuning characteristics are also presented. The plate resonator has no noticeable frequency shift even for AC driving voltages ranging from 223 mV to 2.23 V. The center frequency is still tunable by changing the DC bias voltage, which is ideal for applications that require frequency tunability.
Keywords :
electrodes; micromechanical resonators; AC power handling; DC tuning characteristic; actuation electrode; frequency 12.5 MHz; parasitic resistance; thin-film microshell encapsulation; transverse-mode differential square plate resonator; voltage 223 mV to 2.23 V; Electrodes; Electrostatics; Frequency; Impedance; Micromechanical devices; Packaging; Resonator filters; Shape; Voltage; Wafer scale integration; Out-of-Plane device; RF MEMS; Resonator; Wafer Level Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285839
Filename :
5285839
Link To Document :
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