DocumentCode
1862543
Title
Encapsulated out-of-plane differential square-plate resonator with integrated actuation electrodes
Author
Chen, Kuan-Lin ; Wang, Shasha ; Salvia, James ; Howe, Roger T. ; Kenny, Thomas W.
Author_Institution
Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
1421
Lastpage
1424
Abstract
This paper presents a fully encapsulated 12.5 MHz transverse-mode differential square plate resonator that has out-of-plane actuation electrodes integrated into the thin-film microshell encapsulation. The integration of electrodes minimizes the parasitic resistance, which is generally large for out-of-plane device, and the total footprint of the resonator. Feedthrough capacitance is also minimized by utilizing a differential topology. The AC power handling and DC tuning characteristics are also presented. The plate resonator has no noticeable frequency shift even for AC driving voltages ranging from 223 mV to 2.23 V. The center frequency is still tunable by changing the DC bias voltage, which is ideal for applications that require frequency tunability.
Keywords
electrodes; micromechanical resonators; AC power handling; DC tuning characteristic; actuation electrode; frequency 12.5 MHz; parasitic resistance; thin-film microshell encapsulation; transverse-mode differential square plate resonator; voltage 223 mV to 2.23 V; Electrodes; Electrostatics; Frequency; Impedance; Micromechanical devices; Packaging; Resonator filters; Shape; Voltage; Wafer scale integration; Out-of-Plane device; RF MEMS; Resonator; Wafer Level Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285839
Filename
5285839
Link To Document