Title :
Low cost packaging techniques for commercial GaAs IC components
Author_Institution :
RF Micro Devices Inc., Greensboro, NC, USA
Abstract :
Commercial packaging of GaAs IC components such as Power Amplifiers requires special care to ensure proper thermal management while maintaining low cost. Several types of packages are investigated for electrical and thermal performance. Some examples of ICs which utilize various types of plastic packages are also discussed.
Keywords :
III-V semiconductors; cooling; gallium arsenide; integrated circuit packaging; plastic packaging; power amplifiers; GaAs; IC components; low cost packaging techniques; plastic packages; power amplifiers; thermal management; thermal performance; Costs; Gallium arsenide; Integrated circuit packaging; Plastic packaging; Power amplifiers; Power system reliability; Radio frequency; Radiofrequency amplifiers; Thermal management; Thermal resistance;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1996. Technical Digest 1996., 18th Annual
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-3504-X
DOI :
10.1109/GAAS.1996.567628
