Title :
Ridge-Loaded staggered single-slot rectangular coupled-cavity structure for X-band traveling-wave tube
Author :
Lingna Yue ; Li Zhan ; Yanyu Wei ; Guoqing Zhao ; Wenxiang Wang ; Yubin Gong
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Univ. of Electron. Sci. & Technol. of China Chengdu, Chengdu, China
Abstract :
The analysis of the novel coupled-cavity traveling-wave tube(CC-TWT) operating at X-band is presented for the purpose of gaining higher power with a smaller size compared with the existing coupled cavity circuit. The electromagnetic characteristics, and the beamwave interaction based on the ridge-loaded staggered single-slot rectangular coupled-cavity slow-wave structure(SWS) are investigated. Compared with the existing staggered single-slot rectangular coupled cavity TWT, our designed TWT has the advantage in coupled impedance and electron efficiency, which makes it has the potential of miniaturization in CC-TWT. The calculation results reveal that it can produce saturated output power over 23 kilowatts from 8.6 to 9.5GHz when the cathode voltage are set from 25.9kV to 26.9kV and beam current is 5A, respectively. The corresponding saturated gain and electron efficiency can reach over 39dB and 17.4%.
Keywords :
cathodes; travelling wave tubes; X-band traveling-wave tube; beamwave interaction; cathode voltage; coupled impedance; coupled-cavity traveling-wave tube; current 5 A; electromagnetic characteristics; electron efficiency; frequency 8.6 GHz to 9.5 GHz; ridge-loaded staggered single-slot rectangular coupled-cavity slow-wave structure; ridge-loaded staggered single-slot rectangular coupled-cavity structure; saturated gain; staggered single-slot rectangular coupled cavity TWT; voltage 25.9 kV to 26.9 kV; Bandwidth; Cavity resonators; Electron tubes; Impedance; Integrated circuit modeling; Periodic structures; Power generation; ridge-loaded staggered single-slot rectangular coupled-cavity; slow-wave structure; traveling-wave tube;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2015 IEEE International
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7109-1
DOI :
10.1109/IVEC.2015.7223928