Title :
Fabrication of 3-dimensional silicon microelectrode arrays using micro electro discharge machining for neural applications
Author :
Tathireddy, P. ; Rakwal, D. ; Bamberg, E. ; Solzbacher, F.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA
Abstract :
Ultra high aspect ratio microelectrodes are designed and fabricated to record and stimulate neural signals from deeper areas of the brain and nerves and also to provide a new research tool to the neuroscience community. We present a fabrication process to build ultra high aspect ratio silicon based microelectrode arrays for the neural applications. The mu-wire electrical discharge machining (mu-WEDM) process enables machining electrodes from highly conductive bulk silicon. The electrodes are electrically isolated near their base by glass. Thin, needleshaped and smooth silicon microelectrodes are realized with an optimized chemical etching process.
Keywords :
discharges (electric); etching; machining; microelectrodes; 3D silicon microelectrode arrays; chemical etching; fabrication; micro electro discharge machining; neural applications; neural signals; Chemical processes; Electrodes; Etching; Fabrication; Glass; Machining; Microelectrodes; Neuroscience; Signal design; Silicon; Microelectrode array; Neural array; Utah array; brain-machine interface; silicon bulk machining; wire electrical discharge machining;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285874
