Title :
The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market
Author :
Yang, L.W. ; Chao, P.C. ; Wu, L.
Author_Institution :
RF Integrated Corp., Irvine, CA, USA
Abstract :
The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.
Keywords :
III-V semiconductors; electronics industry; gallium arsenide; integrated circuit economics; integrated circuit manufacture; integrated circuit technology; Asia Pacific wireless market; GaAs IC manufacturing; Taiwan; business model; market perspectives; technology challenges; Cellular phones; Costs; Foundries; Gallium arsenide; Heterojunction bipolar transistors; Integrated circuit modeling; Manufacturing industries; Mass production; Semiconductor device manufacture; Virtual manufacturing;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-6663-8
DOI :
10.1109/GAAS.2001.964336
