DocumentCode
1864381
Title
A Low-Cost, Tiled Embedded Smart Camera System for Computer Vision Applications
Author
Leon-Salas, W.D. ; Velipasalar, Senem ; Schemm, Nathan ; Balkir, Sina
Author_Institution
Nebraska-Lincoln Univ., Lincoln
fYear
2007
fDate
25-28 Sept. 2007
Firstpage
125
Lastpage
131
Abstract
In this demonstration, we present a low-resolution smart camera node with a custom-designed image sensor chip and peer-to-peer networking capabilities. Each camera can perform focal plane processing, and also has the computational power of the embedded controllers. Cameras can send data, such as results of image processing and feature extraction, over a peer-to-peer network. The distributed nature of such a system allows for increased scalability and robustness, and decreased bandwidth requirement over conventional server based systems. In our ongoing work, these lower-cost embedded smart cameras are being tiled instead of fabricating a higher-resolution sensor as a single chip. In our paper, we provide a detailed comparison of fabricating a higher-resolution sensor as a single chip and tiling lower-resolution embedded smart cameras in order to give motivation, and demonstrate the advantages. The comparison is made in terms of bandwidth, clock frequency, area, power, cost and global computations.
Keywords
computer vision; feature extraction; focal planes; image resolution; peer-to-peer computing; computer vision applications; custom-designed image sensor chip; embedded smart camera system; feature extraction; focal plane processing; higher-resolution sensor; image processing; peer-to-peer networking capabilities; Application software; Bandwidth; Computer vision; Embedded computing; Feature extraction; Image processing; Image sensors; Intelligent sensors; Peer to peer computing; Smart cameras; CMOS imager; area; cost; embedded processor; high resolution; power consumption; smart camera; tiling;
fLanguage
English
Publisher
ieee
Conference_Titel
Distributed Smart Cameras, 2007. ICDSC '07. First ACM/IEEE International Conference on
Conference_Location
Vienna
Print_ISBN
978-1-4244-1354-6
Electronic_ISBN
978-1-4244-1354-6
Type
conf
DOI
10.1109/ICDSC.2007.4357515
Filename
4357515
Link To Document